What are the welding process quality control and inspection methods for electronic circuit manufacturing in instrument manufacturingг┐

Welding Process Quality Control and Inspection Methods for Electronic Circuit Manufacturing in Instrument Manufacturing

Against the backdrop of the rapid development of modern science and technology, the manufacturing process of electronic circuits has become an important standard for measuring product quality. As a key link in the manufacturing of electronic circuits, welding technology not only affects the performance and reliability of the circuit but also directly relates to the final quality of the product. Therefore, how to effectively control and detect the quality of welding technology is of great significance for improving the overall performance and competitiveness of electronic products.

Firstly, welding process quality control

Material selection: The selection of welding materials is crucial. It is necessary to select appropriate solder and flux according to the type of circuit board and the requirements of the welding process. The selection of solder should consider its melting point, composition, fluidity, and compatibility with the base material. The selection of flux needs to consider its activity, volatility, and wettability to the welding joint.

Welding temperature control: The welding temperature directly affects the welding effect. Excessive temperature may cause the solder to melt excessively, forming a false joint, while insufficient temperature may form cold welding. Therefore, it is necessary to strictly control the welding temperature, and it is generally recommended to control the welding temperature between 250℃ and 450℃.

　　Welding time control: Insufficient welding time may cause the solder to not melt completely, forminga false joint, while excessive welding time may cause the solder to melt excessively, forming cold welding. The control of welding time is generally determined according to the type of circuit board and the characteristics of the solder.

Welding pressure control: The size of the welding pressure directly affects the formation of the welding joint. Excessive welding pressure may cause the solder to melt excessively, forming cold welding, while insufficient welding pressure may cause the solder to not melt completely, forming a false joint. The control of welding pressure is generally determined according to the type of circuit board and the characteristics of the solder.

Secondly, welding process quality inspection

Welding appearance inspection: By visually inspecting the appearance of the welding joint, including the size, shape, color, smoothness, etc., the quality of the welding can be judged. For large or complex circuit boards, magnifying glasses or microscopes can be used for inspection.

　　Welding joint electrical property inspection: By measuring the resistance, voltage drop, current, and other electrical property parameters of the welding joint, the quality of the welding can be judged. For critical circuits, detailed electricalproperty inspection is required.

Welding joint mechanical property inspection: By measuring the tensile strength, bending strength, and other mechanical property parameters of the welding joint, the quality of the welding can be judged. For critical circuits, detailed mechanical property inspection is required.

Welding joint metallographic inspection: By observing the microstructure of the welding joint under a microscope, the quality of the welding can be judged. For critical circuits, detailed metallographic inspection is required.

　　In summary, by effectively controlling and detecting the quality of welding processes, the welding quality of electronic circuit manufacturing can be ensured, thereby improving the overall performance and competitiveness of electronic products.